3D IC and TSV technologies
3D IC and TSV technologies is a topic indexed in PICO Portal from OpenAlex.
What is known about 3D IC and TSV technologies?
This cluster of papers focuses on the advancements, challenges, and technologies related to Three-Dimensional Integrated Circuits (3D ICs), with a particular emphasis on Through-Silicon Via (TSV) technology, interconnect design, wafer bonding techniques, thermal management strategies, and system integration. The research spans from electrical modeling and microarchitecture to heterogeneous integration and chip stacking.
How many works does 3D IC and TSV technologies have?
3D IC and TSV technologies has 120,814 works in the PICO Portal index. The count is the OpenAlex total, not the number of papers listed on this page.
How many citations does 3D IC and TSV technologies have?
3D IC and TSV technologies has 296,246 citations in the OpenAlex counts PICO Portal stores.
What is the OpenAlex record for 3D IC and TSV technologies?
The OpenAlex for 3D IC and TSV technologies is on the source record.