# Model for a multiple-step deep Si etch process

**Type:** Papers  
**Canonical URL:** https://picoportal.org/library/papers/model-for-a-multiple-step-deep-si-etch-process/

## Facts

| Field | Value |
| --- | --- |
| Author Names | Shahid Rauf,William J. Dauksher,Stephen Clemens,Kenneth H. Smith |
| Citations | 52 |
| DOI | 10.1116/1.1477418 |
| Fields | Engineering |
| Open Access | false |
| OA Status | closed |
| OpenAlex ID | https://openalex.org/W2001733415 |
| Type | article |
| Year | 2002 |

## Paper authors

- [Kenneth H. Smith](https://picoportal.org/library/researchers/kenneth-h-smith/)

## Paper journal

- [Journal of Vacuum Science & Technology A Vacuum Surfaces and Films](https://picoportal.org/library/journals/journal-of-vacuum-science-and-technology-a-vacuum-surfaces-and-films/)

## Paper primary topic

- [Plasma Diagnostics and Applications](https://picoportal.org/library/topics/plasma-diagnostics-and-applications/)

## Paper topics

- [Plasma Diagnostics and Applications](https://picoportal.org/library/topics/plasma-diagnostics-and-applications/)
- [Metal and Thin Film Mechanics](https://picoportal.org/library/topics/metal-and-thin-film-mechanics/)
- [Semiconductor materials and devices](https://picoportal.org/library/topics/semiconductor-materials-and-devices/)

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Source: PICO Portal — public research metadata, principally OpenAlex. See https://picoportal.org/library/sources/ for provenance and https://picoportal.org/library/methodology/ for what these figures mean.